Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

Seok, Seonho

Springer International Publishing AG

05/2018

115

Dura

Inglês

9783319778716

15 a 20 dias

454

Descrição não disponível.

Overview of MEMS packaging technologies.- Adhesion control techniques for debonding.- FEM modeling of debonding.- Polymer cap transfer packaging technologies.- Thin film cap transfer packaging technology.- Other related manufacturing technologies.

Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.

Polymer Packaging cap;Transfer packaging;MEMS packaging;Surface modification;Wafer-level