Three-Dimensional Integration of Semiconductors
-15%
portes grátis
Three-Dimensional Integration of Semiconductors
Processing, Materials, and Applications
Kondo, Kazuo; Kada, Morihiro; Takahashi, Kenji
Springer International Publishing AG
03/2019
408
Mole
Inglês
9783319792552
15 a 20 dias
652
Descrição não disponível.
Research and Development History of Three Dimensional (3D) Integration Technology.- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology.- TSV Processes.- Wafer and Die Bonding Processes.- Metrology and Inspection.- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability.- Trends in 3D Integrated Circuit (3D-IC) Testing Technology.- Dream Chip Project at ASET.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
3D Interconnects;3D Packaging;Die Stacking;Electrodeposition;Semiconductors;Through Silicon-vias;Wafer Handling
Research and Development History of Three Dimensional (3D) Integration Technology.- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology.- TSV Processes.- Wafer and Die Bonding Processes.- Metrology and Inspection.- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability.- Trends in 3D Integrated Circuit (3D-IC) Testing Technology.- Dream Chip Project at ASET.
Este título pertence ao(s) assunto(s) indicados(s). Para ver outros títulos clique no assunto desejado.
